SC Exhibits - Exhibitor Details
Products and Services:
- Communication (Hardware)
Data Management (Hardware)
VI Chip, Inc., a subsidiary of Vicor Corporation, designs, manufactures, and markets high-density, high-performance VI chip power solutions to enable next generation power architecture in high-end computing, automated test equipment (ATE), telecom, solid state lighting/LED, and defense markets worldwide.
Presenting at SCExhibitor Forum
- Stephen J. Oliver (V. I. Chip Inc.)
- Efficient, Power Dense, and Flexible Power Conversion Solutions for Blade, Cluster, and Mainframe Servers
- Optimizing efficiency and power density in mainframe systems often comes with a trade-off in design flexibility. A 380VDC architecture for 'big iron' with loads of 100s of amps at <1V is unlikely to be optimal powering 'plug and play' rack-mount server motherboards.
Factorized Power Architecture (FPA) is a power component building block approach which can scale up for high power with high distribution & conversion efficiency, yet is flexible to enable lower power systems to utilize the energy saving benefits and maximize processing performance per rack.
Using 48V to drive processor/memory domains while providing 12V power for legacy loads (drives, I/O, etc.), FPA presents the optimal solution of efficiency, power density and flexibility for high power custom servers and lower power 'off the shelf' server configurations. The 'pure powertrain' solution is processor & controller 'agnostic', running in any analog or digital system so mixed-core / cluster systems are easily driven.